A chip removal facility for indium bump bonded pixel detectors
Titel:
A chip removal facility for indium bump bonded pixel detectors
Auteur:
Airoldi, A. Alimonti, G. Amati, M. Andreazza, A. Bulgheroni, A. Caccia, M. Giugni, D. Kucewicz, W. Lari, T. Meroni, C. Ragusa, F. Troncon, C. Vegni, G.
Verschenen in:
Nuclear instruments and methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment