Development of new assembly techniques for a silicon micro-vertex detector unit using the flip-chip bonding method
Titel:
Development of new assembly techniques for a silicon micro-vertex detector unit using the flip-chip bonding method
Auteur:
Saitoh, Y. Takeuchi, H. Mandai, M. Kanazawa, H. Yamanaka, J. Miyahara, S. Kamiya, M. Fujita, Y. Higashi, Y. Ikeda, H. Ikeda, M. Koike, S. Matsuda, T. Ozaki, H. Tanaka, M. Tsuboyama, T. Avrillon, S. Okuno, S. Haba, J. Hanai, H. Mori, S. Yusa, K. Fukunaga, C.
Verschenen in:
Nuclear instruments and methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment