Characterisation of the HEXITEC 4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology
Titel:
Characterisation of the HEXITEC 4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology
Auteur:
Veale, M.C. Booker, P. Church, I. Jones, L.L. Lipp, J. Schneider, A. Seller, P. Wilson, M.D. Chsherbakov, I. Kolesnikova, I. Lozinskaya, A. Novikov, V. Tolbanov, O. Tyazhev, A. Zarubin, A.
Verschenen in:
Nuclear instruments and methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment