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Journal description
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Details for article 35 of 43 found articles
| Title: |
Silicon cantilever arrays with by-pass metal through-silicon-via (TSV) tips for micromachined IC testing probe cards |
| Author: |
Wang, Fei Li, Xinxin Cheng, Rong Jiang, Kewei Feng, Songlin |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 86 (2009) nr. 11 pages 6 p. |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 35 of 43 found articles
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