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Journal description
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Details for article 118 of 138 found articles
| Title: |
Stabilized filling simulation of microchip encapsulation process |
| Author: |
Wang, Hui Zhou, Huamin Zhang, Yun Li, Dequn |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 87 (2010) nr. 12 pages 8 p. |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 118 of 138 found articles
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