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Journal description
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Details for article 89 of 187 found articles
| Title: |
High-powered thermal gel degradation evaluation on board-level HFCBGA subjected to reliability tests |
| Author: |
Wang, Tong Hong Chen, Hsuan-Yu Lee, Chang-Chi Lai, Yi-Shao |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 88 (2011) nr. 10 pages 7 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 89 of 187 found articles
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