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Journal description
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Details for article 136 of 187 found articles
| Title: |
Physical investigation of the impact of electrolessly deposited self-aligned caps on insulation of copper interconnects |
| Author: |
Olivier, S. Decorps, T. Bernard, M. Haumesser, P.H. Passemard, G. |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 85 (2008) nr. 10 pages 4 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 136 of 187 found articles
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