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Journal description
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Details for article 4 of 57 found articles
| Title: |
Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study |
| Author: |
Chiu, Meng-Chun Tsai, Min-Yan Wang, Shan-Bo Lin, Yung-Sheng Liang, Chien-Lung |
| Appeared in: |
Surface & coatings technology |
| Paging: | Volume 484 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 57 found articles
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