Electrodeposited Sn-Cu-Ni alloys as lead-free solders on copper substrate using deep eutectic solvents: The influence of electrodeposition mode on the morphology, composition and corrosion behaviour
Titel:
Electrodeposited Sn-Cu-Ni alloys as lead-free solders on copper substrate using deep eutectic solvents: The influence of electrodeposition mode on the morphology, composition and corrosion behaviour
Auteur:
State, Sabrina Patricia Costovici, Stefania Mousavi, Mirsajjad Garcia, Yaiza Gonzalez Zanella, Caterina Cojocaru, Anca Anicai, Liana Visan, Teodor Enachescu, Marius