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Journal description
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Details for article 44 of 50 found articles
| Title: |
Thermal evolution, phase composition and fracture toughness of electroless Ni-P, Ni-W-P and Ni-Mo-W-P films for solderable surfaces on copper |
| Author: |
Sharma, Tanu Bera, Holger Brown, Delilah A. Schulze, Andreas Brüning, Ralf |
| Appeared in: |
Surface & coatings technology |
| Paging: | Volume 467 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 44 of 50 found articles
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