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                                       Details for article 61 of 74 found articles
 
 
  Redeposition-free of silicon etching by CF4 microwave plasma in a medium vacuum process regime
 
 
Title: Redeposition-free of silicon etching by CF4 microwave plasma in a medium vacuum process regime
Author: Pakpum, C.
Boonyawan, D.
Appeared in: Surface & coatings technology
Paging: Volume 397 () nr. C pages p.
Year: 2020
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 61 of 74 found articles
 
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