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Details for article 19 of 37 found articles
| Title: |
Influence of Pd(P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu multilayer |
| Author: |
Lee, C.Y. Yang, S.P. Yang, C.H. Lu, M.K. Kuo, T.T. Ho, C.E. |
| Appeared in: |
Surface & coatings technology |
| Paging: | Volume 395 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 37 found articles
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