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Journal description
All volumes of the corresponding journal
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Details for article 47 of 90 found articles
| Title: |
Influence of current density on the adhesion of seedless electrodeposited copper layers on silicon |
| Author: |
Goncalves de Cerqueira Lima, Frederico Mescheder, Ulrich Leiste, Harald Müller, Claas |
| Appeared in: |
Surface & coatings technology |
| Paging: | Volume 375 (2019) nr. C pages 554-564 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 47 of 90 found articles
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