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Journal description
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Details for article 2 of 36 found articles
| Title: |
A Pd-free activation method for electroless nickel deposition on copper |
| Author: |
Tian, Dong Li, De Y. Wang, Fang F. Xiao, Ning Liu, Rui Q. Li, Ning Li, Qing Gao, Wei Wu, Gang |
| Appeared in: |
Surface & coatings technology |
| Paging: | Volume 228 (2013) nr. C pages 7 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 36 found articles
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