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                                       Details for article 23 of 54 found articles
 
 
  Improvement in adhesion of diamond film on Cu substrate with an inlay structured interlayer
 
 
Title: Improvement in adhesion of diamond film on Cu substrate with an inlay structured interlayer
Author: Qiu, W.Q.
Dasari, A.
Mai, Y.-W.
Appeared in: Surface & coatings technology
Paging: Volume 206 (2011) nr. 2-3 pages 4 p.
Year: 2011
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 23 of 54 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands