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                                       Details for article 12 of 13 found articles
 
 
  Role of additives in electroless copper plating using hypophosphite as reducing agent
 
 
Title: Role of additives in electroless copper plating using hypophosphite as reducing agent
Author: Gan, Xueping
Zhou, Kechao
Hu, Wenbin
Zhang, Dou
Appeared in: Surface & coatings technology
Paging: Volume 206 (2012) nr. 15 pages 5 p.
Year: 2012
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 12 of 13 found articles
 
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