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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 48 of 124 found articles
| Title: |
Evaluation of stress during and after sputter deposition of Cu and Ta films |
| Author: |
Navid, A.A. Chason, E. Hodge, A.M. |
| Appeared in: |
Surface & coatings technology |
| Paging: | Volume 205 (2010) nr. 7 pages 7 p. |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 48 of 124 found articles
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