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                                       Details for article 66 of 135 found articles
 
 
  Improvement of copper plating adhesion of PPE printed wiring board by plasma treatment
 
 
Title: Improvement of copper plating adhesion of PPE printed wiring board by plasma treatment
Author: Ikari, Shohei
Kashiwade, Hiroshi
Matsuoka, Takashi
Hirayama, Tomoko
Ishida, Shuiti
Kato, Kiyotaka
Appeared in: Surface & coatings technology
Paging: Volume 202 (2008) nr. 22-23 pages 3 p.
Year: 2008
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 66 of 135 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands