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  Effects of NH4F on the deposition rate and buffering capability of electroless Ni–P plating solution
 
 
Title: Effects of NH4F on the deposition rate and buffering capability of electroless Ni–P plating solution
Author: Ying, H.G.
Yan, M.
Ma, T.Y.
Wu, J.M.
Yu, L.Q.
Appeared in: Surface & coatings technology
Paging: Volume 202 (2007) nr. 2 pages 5 p.
Year: 2007
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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