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Journal description
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Details for article 36 of 111 found articles
| Title: |
Electron backscatter diffraction analysis on the microstructures of electrolytic Cu deposition in the through hole filling process: Butterfly deposition mode |
| Author: |
Ho, C.E. Hsieh, W.Z. Chen, C.C. Lu, M.K. |
| Appeared in: |
Surface & coatings technology |
| Paging: | Volume 259 (2014) nr. PB pages 6 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 36 of 111 found articles
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