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                                       Details for article 111 of 182 found articles
 
 
  Microstructure and mechanical properties of Ti3SiC2/Ti3SiC2 diffusion bonded joints using Ti foil as an interlayer
 
 
Title: Microstructure and mechanical properties of Ti3SiC2/Ti3SiC2 diffusion bonded joints using Ti foil as an interlayer
Author: Wang, Y.
Wu, X.F.
Yang, Z.W.
Xia, Y.H.
Wang, D.P.
Appeared in: Ceramics international
Paging: Volume 45 (2019) nr. 16 pages 20900-20909
Year: 2019
Contents:
Publisher: Elsevier Ltd and Techna Group S.r.l.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 111 of 182 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands