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  Diffusion–fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing
 
 
Title: Diffusion–fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing
Author: Ri, Shien
Saka, Masumi
Appeared in: Materials letters
Paging: Volume 79 (2012) nr. C pages 3 p.
Year: 2012
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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