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Journal description
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Details for article 41 of 55 found articles
| Title: |
Study on microstructure and properties of Cu-based SOIC component/flexible printed circuit board laser soldering joint |
| Author: |
Chen, Wen-gang Yang, Jia-wei Teng, Fei Chen, Qi-yuan Huan, Peng-cheng Cui, Chen-shuo Wang, Xiao-nan |
| Appeared in: |
Materials letters |
| Paging: | Volume 397 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 41 of 55 found articles
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