|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 32 of 67 found articles
| Title: |
High performance Cu/SAC305 solder low temperature bonding using Ti3C2 MXene interlayer |
| Author: |
Yang, Wenhua Huang, Xin Zhang, Siyu Xie, Chao Huang, Zhixiang Hu, Doumeng |
| Appeared in: |
Materials letters |
| Paging: | Volume 373 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 32 of 67 found articles
| << previous | next >> |