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Journal description
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Details for article 49 of 82 found articles
| Title: |
Low-temperature bonding of Cu on Si3N4 substrate by using Ti/Cu thin films |
| Author: |
Song, Yanyu Liu, Ling Liu, Duo Song, Xiaoguo Cao, Jian |
| Appeared in: |
Materials letters |
| Paging: | Volume 320 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 49 of 82 found articles
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