Digital Library
Close Browse articles from a journal
 
<< previous    next >>
     Journal description
       All volumes of the corresponding journal
         All issues of the corresponding volume
           All articles of the corresponding issues
                                       Details for article 74 of 101 found articles
 
 
  Phase identification and interface evolution of ENIG/Cu-core SAC305/ENIG solder joints after the thermal-electrical coupling reliability test
 
 
Title: Phase identification and interface evolution of ENIG/Cu-core SAC305/ENIG solder joints after the thermal-electrical coupling reliability test
Author: Fleshman, Collin
Song, Rui-Wen
Tsai, Su-Yueh
Duh, Jenq-Gong
Appeared in: Materials letters
Paging: Volume 275 () nr. C pages p.
Year: 2020
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 74 of 101 found articles
 
<< previous    next >>
 
 Koninklijke Bibliotheek - National Library of the Netherlands