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Journal description
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Details for article 53 of 101 found articles
| Title: |
Interfacial evolution and mechanical properties of Au–Sn solder jointed Cu heat sink during high temperature storage test |
| Author: |
Ho, Ching-Yuan Lin, Chia-Wei Lee, Yueh-Yang Cheng, Shao-Chien |
| Appeared in: |
Materials letters |
| Paging: | Volume 275 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 53 of 101 found articles
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