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Journal description
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Details for article 2 of 114 found articles
| Title: |
Aging resistance of the Sn-Ag-Cu solder joints doped with Mo nanoparticles |
| Author: |
Yang, Linmei Quan, Shanyu Liu, Cong Shi, Guimei |
| Appeared in: |
Materials letters |
| Paging: | Volume 253 (2019) nr. C pages 191-194 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 114 found articles
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