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Journal description
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Details for article 22 of 91 found articles
| Title: |
Dissolution and nucleation behavior of Al in Ta/Sn/Al joints during ultrasonic-assisted soldering |
| Author: |
Yang, Haifeng Tan, Qi Ji, Hongjun Wang, Zhihong Xu, Wenfu Li, Mingyu |
| Appeared in: |
Materials letters |
| Paging: | Volume 252 (2019) nr. C pages 103-105 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 22 of 91 found articles
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