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                                       Details for article 51 of 78 found articles
 
 
  Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction
 
 
Title: Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction
Author: Hu, F.Q.
Zhang, Q.K.
Jiang, J.J.
Song, Z.L.
Appeared in: Materials letters
Paging: Volume 214 (2018) nr. C pages 142-145
Year: 2018
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 51 of 78 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands