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Journal description
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Details for article 11 of 46 found articles
| Title: |
Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints |
| Author: |
Li, Hailong An, Rong Wang, Chunqing Tian, Yanhong Jiang, Zhi |
| Appeared in: |
Materials letters |
| Paging: | Volume 144 (2015) nr. C pages 3 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 46 found articles
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