|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 59 of 120 found articles
| Title: |
Local distribution of residual stress of Cu in LSI interconnect |
| Author: |
Sato, Hisashi Shishido, Nobuyuki Kamiya, Shoji Koiwa, Kozo Omiya, Masaki Nishida, Masahiro Suzuki, Takashi Nakamura, Tomoji Nokuo, Takeshi |
| Appeared in: |
Materials letters |
| Paging: | Volume 136 (2014) nr. C pages 4 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 59 of 120 found articles
| << previous | next >> |