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Journal description
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Details for article 35 of 80 found articles
| Title: |
Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints |
| Author: |
Chen, Wei-Yu Tu, Wei Chang, Hsiang-Ching Chou, Tzu-Ting Duh, Jenq-Gong |
| Appeared in: |
Materials letters |
| Paging: | Volume 134 (2014) nr. C pages 3 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 35 of 80 found articles
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