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Journal description
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Details for article 47 of 67 found articles
| Title: |
Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer |
| Author: |
Wu, Yi-Hsin Yu, Chi-Yang Ho, Cheng-Ying Duh, Jenq-Gong |
| Appeared in: |
Materials letters |
| Paging: | Volume 105 (2013) nr. C pages 3 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 47 of 67 found articles
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