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Journal description
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Details for article 3 of 157 found articles
| Title: |
Analysis of tensile strength and microstructure of Ni–SiC composites prepared by electroforming |
| Author: |
Liu, Lei Zhao, Haijun Hu, Wenbin Shen, Bin |
| Appeared in: |
Materials letters |
| Paging: | Volume 59 (2005) nr. 24-25 pages 4 p. |
| Year: |
2005 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 157 found articles
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