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Journal description
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Details for article 14 of 213 found articles
| Title: |
Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy |
| Author: |
Gao, Feng Cheng, Fangjie Nishikawa, Hiroshi Takemoto, Tadashi |
| Appeared in: |
Materials letters |
| Paging: | Volume 62 (2008) nr. 15 pages 3 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 213 found articles
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