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                                       Details for article 12 of 19 found articles
 
 
  Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy
 
 
Title: Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy
Author: Ding, Yong
Kim, Jang-Kyo
Tong, Pin
Appeared in: Mechanics of materials
Paging: Volume 38 (2006) nr. 1-2 pages 14 p.
Year: 2006
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 12 of 19 found articles
 
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