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                                       Details for article 16 of 58 found articles
 
 
  Effective acquisition of elastoplastic and creep parameters of lead-free solder alloy from high-temperature micro-indentation eliminating the size effect
 
 
Title: Effective acquisition of elastoplastic and creep parameters of lead-free solder alloy from high-temperature micro-indentation eliminating the size effect
Author: Xiao, Gesheng
Ma, Yuhong
Ji, Xinkuo
Wang, Tiejun
Shu, Xuefeng
Liu, Erqiang
Appeared in: Mechanics of materials
Paging: Volume 160 () nr. C pages p.
Year: 2021
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 16 of 58 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands