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Journal description
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Details for article 2 of 12 found articles
| Title: |
A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias |
| Author: |
Said, Mostafa Shalaby, Ahmed Mehdipour, Farhad Biglari-Abhari, Morteza El-Sayed, Mohamed |
| Appeared in: |
Microprocessors and microsystems |
| Paging: | Volume 43 (2016) nr. C pages 21 p. |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 12 found articles
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