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Journal description
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Details for article 52 of 59 found articles
| Title: |
The design concept and implementation of ultra-precision thinning grinder for SiC wafers |
| Author: |
Li, Tianyu Zhu, Xianglong Kang, Renke Dai, Lihao Li, Meng |
| Appeared in: |
Precision engineering |
| Paging: | Volume 94 () nr. C pages 251-263 |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 52 of 59 found articles
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