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                                       Details for article 49 of 80 found articles
 
 
  Material removal rate model for chemical–mechanical polishing of single-crystal SiC substrates using agglomerated diamond abrasive
 
 
Title: Material removal rate model for chemical–mechanical polishing of single-crystal SiC substrates using agglomerated diamond abrasive
Author: Wu, Pengfei
Liu, Ning
Li, Xue
Zhu, Yongwei
Appeared in: Precision engineering
Paging: Volume 88 () nr. C pages 572-583
Year: 2024
Contents:
Publisher: Elsevier Inc.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 49 of 80 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands