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                                       Details for article 25 of 35 found articles
 
 
  Microscopic stress analysis of nanoscratch induced sub-surface defects in a single-crystal silicon wafer
 
 
Title: Microscopic stress analysis of nanoscratch induced sub-surface defects in a single-crystal silicon wafer
Author: Huang, Ning
Zhou, Ping
Goel, Saurav
Appeared in: Precision engineering
Paging: Volume 82 () nr. C pages 290-303
Year: 2023
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 25 of 35 found articles
 
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