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Journal description
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Details for article 32 of 32 found articles
| Title: |
Viscoelastic behavior of polishing pad: Effects on edge roll-off during silicon wafer polishing |
| Author: |
Satake, Urara Harada, Sena Enomoto, Toshiyuki |
| Appeared in: |
Precision engineering |
| Paging: | Volume 62 () nr. C pages 30-39 |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 32 of 32 found articles
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