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Journal description
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Details for article 3 of 16 found articles
| Title: |
Curing kinetic analysis of phenolic resin filled with nonmetallic materials reclaimed from waste printed circuit boards |
| Author: |
Guo, Jie Lin, Kuangfei Xu, Zhenming |
| Appeared in: |
Thermochimica acta |
| Paging: | Volume 556 (2013) nr. C pages 5 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 16 found articles
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