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                                       Details for article 33 of 67 found articles
 
 
  Moduli development of epoxy adhesives during cure
 
 
Title: Moduli development of epoxy adhesives during cure
Author: Puentes, John
Colon Quintana, Jose L.
Chaloupka, Alexander
Rudolph, Natalie
Osswald, Tim A.
Appeared in: Polymer testing
Paging: Volume 77 (2019) nr. C pages p.
Year: 2019
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 33 of 67 found articles
 
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