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Journal description
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Details for article 18 of 22 found articles
| Title: |
Laser cutting silicon-glass double layer wafer with laser induced thermal-crack propagation |
| Author: |
Cai, Yecheng Yang, Lijun Zhang, Hongzhi Wang, Yang |
| Appeared in: |
Optics and lasers in engineering |
| Paging: | Volume 82 (2016) nr. C pages 13 p. |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 22 found articles
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