|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 10 of 12 found articles
| Title: |
Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle |
| Author: |
Su, Jinrong Ma, Runbo Chen, Xinwei Han, Liping Yang, Rongcao Zhang, Wenmei |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 58 () nr. C pages 83-88 |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 12 found articles
| << previous | next >> |