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  An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration
 
 
Title: An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration
Author: Lorival, Jean-Etienne
Calmon, Francis
Sun, Fengyuan
Frantz, Felipe
Plossu, Carole
Le Berre, Martine
O’Connor, Ian
Valorge, Olivier
Charbonnier, Jean
Henry, David
Gontrand, Christian
Appeared in: Microelectronics journal
Paging: Volume 46 () nr. 2 pages 153-165
Year: 2015
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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