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Journal description
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Details for article 6 of 22 found articles
| Title: |
A novel simulation methodology for full chip-package thermo-mechanical reliability investigations |
| Author: |
Karunamurthy, Balamurugan Ostermann, Thomas Bhattacharya, Monojit Maity, Sandipan |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 45 () nr. 7 pages 966-971 |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 22 found articles
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