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Journal description
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Details for article 2 of 13 found articles
| Title: |
A hybrid optimization approach for chip placement of multi-chip module packaging |
| Author: |
Yang, Ping Qin, Xiangnan |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 40 () nr. 8 pages 1235-1243 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 13 found articles
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